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Resonac makes the most of its technologies pertaining to inorganic, metal, and organic chemistry, and provides individualized products for various fields including energy, environment, information, and electronics industries.

Innovative Materials Solutions

High relative permittivity materials for transfer molding

It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent…

[Thorough Commentary] What are transmission loss, dielectric loss, and dielectric loss tangent?

This article mainly explains the causes of transmission loss in printed circuit boards, calculation…

Stress-absorption prepreg for reducing solder cracks

It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress…

Mold cleaning sheets for semiconductor manufacturing processes

A cleaning material made of thermosetting synthetic rubber. Place it on the mold, sandwich it between the molds and heat it to remove dirt.

Precision 3DP using UV curable monomers

Fancryl 500 Series has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.

A bonding film allowing to construct a PTFE multilayer

It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress…

Die-bonding paste providing 180 W/(m・k) of thermal conductivity.

It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.

High heat-resistant coating material that prevents delamination

It is a coating material that has both high heat resistance and adhesion. Prevents delamination between encapsulants and substrate materials even in harsh temperature environments.

Crosslinking agent for preventing degradation of rubber products

A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.

Binder for lithium-ion batteries contributing to higher capacity

A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.

Cleaning sheets for rubber molding that remove stains.

It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.

A heat-resistant binder resin that conforms to REACH regulations

Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.

A film capable of bonding a low heat-resistant circuit board.

It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.

Next Generation Resin for High-Speed Communication

SF Resin enables next generation 5G millimeter wave communication technology in automotive applications with exemplary dielectric performance across a range of temperature conditions.

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