Anisotropic Conductive Film
for Solderless Connective Film
MF Series is developed based on ACF technology for non display uses.
Features
- Suitable for thin package devices
- Fine pitch interconnection
- Reducing processing cost
Principle of Connection
![placeholder](https://am.resonac.com/wp-content/uploads/2022/10/placeholder.png)
Applications
![for Solderless Connective Film for Solderless Connective Film](https://am.resonac.com/wp-content/uploads/2022/12/for_solderless_connective_film_2.jpeg)
Others Electronic paper, Touch panel, Printer, Hard disk, Sensor