Base Materials for PWBs

Halogen Free, High Tg, Low Transmission Loss Multilayer Material – MCL-LW-900G/910G

Product Information and Application

Product form

  • CCL: MCL-LW-900G/910G
  • Prepreg: GWA-900G/910G

Applications

  • High-speed computer, server
  • High-speed Router
  • High Frequency Devices, Antenna

Features

  • MCL-LW-910G achieved low dielectric constant (3.3 at 10GHz) and low dissipation factor (0.0028 at 10GHz) using low Dk glass and HVLP copper.
  • Enables high-speed transmission/communication at 25Gbps by low transmission loss properties.
  • Has excellent heat resistance and connection reliability.

Characteristics

Dielectric characterization results

Halogen Free, High Tg, Low Transmission Loss Multilayer Material - MCL-LW-900G/910G
Halogen Free, High Tg, Low Transmission Loss Multilayer Material - MCL-LW-900G/910G

Measurement Conditions

  • Method: Triplate-Line Resonato (r JPCA-TM001)
  • Temperature & Humidity: 25℃/60%RH
  • Laminate Thicknes (s b): 1.6mm (Signal-Ground: 800 µm), Trace thickness(t): 18 µm (RT, HVLP)
  • Signal Conductor Line Width(w): 1mm (Zo: ca.50Ω)
Halogen Free, High Tg, Low Transmission Loss Multilayer Material - MCL-LW-900G/910G

Transmission Loss

Halogen Free, High Tg, Low Transmission Loss Multilayer Material - MCL-LW-900G/910G

Measurement Conditions

  • Evaluation PWB: Strip-line
  • Temperature & Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50Ω
  • Inner layer surface treatment: Black-reduction
  • Proofreading method: TRL (Thru-Reflect-Line)
Halogen Free, High Tg, Low Transmission Loss Multilayer Material - MCL-LW-900G/910G
  • Trace width(w): 0.120mm
  • Dielectric thickness(b): 0.25mm
  • Trace thickness(t): 18 µm

Thin Laminate

(t0.8mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-LW-900G MCL-LW-910G
Tg TMA method A ℃ 190–210 2.4.24
DMA method A 220–260 ‐
CTE *1 X (30–120℃) A ppm/℃ 12–15 ‐
Y (30–120℃) 12–15
Z (＜Tg) A 35–45 2.4.24
(＞Tg) A 230–280
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T-260 (Without Copper) A min. ＞60 2.4.24.1
T-288 (Without Copper) ＞60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 410–450 2.3.40
Copper Peel Strength 18 µm RT A kN/m 0.4–0.7 2.4.8
18 µm HVLP 0.4–0.7
Flexural Modulus (Lengthwise) A GPa 16–21 2.4.4
 Dielectric Constant 10GHz *2 A － 3.60–3.80 3.20–3.40 IEC-62810
 Dissipation Factor 10GHz *2 A － 0.0040–0.0050 0.0020–0.0030
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.7
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐

*1) Heating Rate: 10℃/min., *2) Measured by Cavity Resonator., *3) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-LW-900G
(E glass cloth)MCL-LW-910G
(Low Dk glass cloth)		 ̶ 18 µm
35 µm
70 µm
(RT)12 µm
18 µm
35 µm
(HVLP)		 M0.05 0.05mm
M0.06 0.06mm
M0.08 0.08mm
0.1 0.10mm
M0.11 0.10mm
0.13 0.13mm
M0.15 0.15mm
0.2 0.20mm
0.26 0.25mm

Note 1) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GWA-900G 0.05 (1037N72) 1037 72±2 0.050
0.06 (1078N65) 1078 65±2 0.078
0.08 (3313N57) 3313 57±2 0.106
0.1 (2116N55) 2116 55±2 0.125
GWA-910G 0.05 (1037N74) 1037 74±2 0.050
0.06 (1078N67) 1078 67±2 0.078
0.08 (2013N59) 2013 59±2 0.106
0.1 (2116N57) 2116 57±2 0.125
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.