Base Materials for PWBs

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material – MCL-E-700G (Type R)

Product Information and Application

Product form

  • CCL: MCL-E-700G (Type R)
  • Prepreg: GEA-700G

Applications

  • Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
  • HDI, PWB
  • Thinner Module PWB.

Features

  • Has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
  • Well-suited for build-up construction.
  • Good drill processability: lower process cost.

Characteristics

Elastic Modulus

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-700G (Type R)

Amount of deflection by hole area

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-700G (Type R)

Warpage of FC-BGA

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-700G (Type R)

TEG Chip

  • Chip size: 20mm×20mm
  • Chip thickness: 0.725mm
  • Bump diameter: 80 µm
  • Bump pitch: 200 µm

TEG Substrate

  • Sub size: 35mm×35mm
  • Core thickness: 0.7mm
  • Build up thickness: 30 µm×2 stack
  • SR thickness: 20 µm
Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-700G (Type R)

Thin Laminate

(t0.4mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
700G (Type R)
Tg TMA method A 250–270 2.4.24
DMA method A 295–305
CTE *1 X (30–120℃) A ppm/℃ 8–10
Y (30–120℃) 8–10
*4 (<Tg) A 15–25 2.4.24
(>Tg) A 90–120
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without Copper) A min. >60 2.4.24.1
T-288 (Without Copper) >60
Decomposition Temperature (TGA method 5% Weight Loss) A 430–450 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycle >20
Copper Peel Strength 12 µm A kN/m 0.9–1.1 2.4.8
18 µm 1.0–1.2
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) *4 A GPa 32–34
Dielectric Constant 10GHz *2 A 4.6–4.8
Dissipation Factor 10GHz *2 A 0.008–0.010
Volume Resistivity C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016
D-2/100 1×1012–1×1014

1) Heating Rate: 10℃/min., *2) Measured by SPDR., *3) Refer to “Condition Note“ *4)t0.8mm
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate thickness
MCL-E-700G (R) 2 µm, 3 µm, 12 µm
(LP, PF)
U0.04 0.04mm
U0.05 0.05mm
T0.06 0.06mm
(R) 2 µm
3 µm
12 µm
18 µm
(STD, LP, PF)
M0.06 0.06mm
0.1 0.11mm
M0.11 0.10mm
M0.15 0.15mm
M0.22 0.21mm
2 µm
3 µm
12 µm
18 µm
(STD, LP, PF)
0.2 0.20mm
0.31 0.30mm
0.41 0.40mm
0.51 0.50mm
0.61 0.60mm
0.71 0.70mm

Note1) STD: Standard copper foil, LP: Low profile copper foil, PF: Profile-free copper foil.
Note2) STD: 12 µm, 18 µm; LP: 2 µm, 3 µm, 12 µm, 18 µm; PF: 2 µm, 3 µm, 12 µm.
Note3) ”U” for 1-ply, “T” for 2-ply.
Note4) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)
Dielectric Thickness
after Lamination *1 (mm)
GEA-700G (–) 0.025 (1017N74) 1017 74±2 0.025
0.03 (1027N74) 1027 74±2 0.040
0.04 (1037N74) 1037 74±2 0.048
0.06 (1078N66) 1078 66±2 0.072
0.1 (2116N59) 2116 59±2 0.127
Reference (IPC-TM-650) 2.3.16

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.