Innovative Material Solutions
Achieving both low dielectric properties and high adhesion to copper foil! Primer for millimeter-wave circuit substrates
As the communications industry pursues higher speed and larger capacity from 5G to “5G-Advanced” to even “Beyond 5G (6G),” more and more attention is focused on higher frequency bands from millimeter to sub-terahertz waves.
What is ACF (Anisotropic Conductive Film)? Its usages, how to apply, types, and more are explained.
ACF is the initialism for “Anisotropic Conductive Film” or “Anisotropic Conductive Adhesive Film.” It is made of resins, such as thermoset epoxy resin, in which conductive particles are dispersed.
WelQuick for multi-materials of automobile structural members
Example of using WelQuick. Simplify the process by bonding dissimilar materials in automotive structural components in a short amount of time. Also high adhesion is achieved.
High reliability die bonding paste for total cost reduction
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
High relative permittivity materials for transfer molding
It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent…
High Thermal Conductive and Moisture Resistance AlN Filler
New thermal conductive filler with high thermal conductivity, insulation reliability and moisture resistance.
WelQuick: Quickly Bonding Film of Dissimilar Materials
Strong bonding of dissimilar materials can be achieved quickly by welded film, which applies to a diverse range of adhesion needs.
Solder resists for flexible wiring boards “SN Series”
A modified polyimide resin that has both insulation and flexibility. Achieved excellent insulation reliability, detergent resistance, salt water resistance, and low leakage current.
[Thorough Commentary] What are transmission loss, dielectric loss, and dielectric loss tangent?
This article mainly explains the causes of transmission loss in printed circuit boards, calculation…
A bonding film allowing to construct a PTFE multilayer
It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress…
SKYVEHEATSINK realizing miniaturization and weight reduction
By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation…
WelQuick for leak sealing of terminal blocks
Example of using WelQuick. Leak sealing of large current terminals can be done easily. Easy to handle due to its film shape. WelQuick contribute to significant process reductions and cost reductions.
Precision 3DP using UV curable monomers
Fancryl 500 Series has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.
Laminate film cooler “LAMICOOLER”
A new cooling device applied the packaging materials of pouch type Li-ion batteries SPALF as materials for the heat exchanger. Resonac can design compact and light-weighted heat exchanger.
Die-bonding paste providing 180 W/(m・k) of thermal conductivity.
It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.
Stress-absorption prepreg for reducing solder cracks
Mold cleaning sheets for semiconductor manufacturing processes
A cleaning material made of thermosetting synthetic rubber. Place it on the mold, sandwich it between the molds and heat it to remove dirt.
Cleaning sheets for rubber molding that remove stains.
It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.
Crosslinking agent for preventing degradation of rubber products
A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.
Binder for lithium-ion batteries contributing to higher capacity
A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.
Aluminum/Plastic Composite Food Containers
Almic-Can is a food container made from laminated aluminum foil and resin sheets. This container can thus contribute to solving the issue of food waste and reducing plastic consumption.
A film capable of bonding a low heat-resistant circuit board.
It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.
WelQuick for base material connection in Roll to Roll process
Example of using WelQuick. Strong adhesion can be obtained simply by placing the film on the joints of the substrates in the Roll to Roll process such as FPC and heat-sealing them.
Heat resistant coating binder PNVA GE191 Series
Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs.
A heat-resistant binder resin that conforms to REACH regulations
Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.
Al-Plastic direct-bonding for reducing the production process
We finally achieved direct-bonding of metal with thermoplastic and thermosetting resins. They are expected to reduce the production process time and downsize the products.
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