Innovative Material Solutions

As the communications industry pursues higher speed and larger capacity from 5G to “5G-Advanced” to even “Beyond 5G (6G),” more and more attention is focused on higher frequency bands from millimeter to sub-terahertz waves.

ACF is the initialism for “Anisotropic Conductive Film” or “Anisotropic Conductive Adhesive Film.” It is made of resins, such as thermoset epoxy resin, in which conductive particles are dispersed.

Example of using WelQuick. Simplify the process by bonding dissimilar materials in automotive structural components in a short amount of time. Also high adhesion is achieved.

Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.

Innovative Materials Solutions

It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent…

New thermal conductive filler with high thermal conductivity, insulation reliability and moisture resistance.

Strong bonding of dissimilar materials can be achieved quickly by welded film, which applies to a diverse range of adhesion needs.

A modified polyimide resin that has both insulation and flexibility. Achieved excellent insulation reliability, detergent resistance, salt water resistance, and low leakage current.

Innovative Materials Solutions

This article mainly explains the causes of transmission loss in printed circuit boards, calculation…

Innovative Materials Solutions

It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress…

By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation…

Example of using WelQuick. Leak sealing of large current terminals can be done easily. Easy to handle due to its film shape. WelQuick contribute to significant process reductions and cost reductions.

Innovative Materials Solutions

Fancryl 500 Series has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.

A new cooling device applied the packaging materials of pouch type Li-ion batteries SPALF as materials for the heat exchanger. Resonac can design compact and light-weighted heat exchanger.

It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.

Innovative Materials Solutions

It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress…

Innovative Materials Solutions

A cleaning material made of thermosetting synthetic rubber. Place it on the mold, sandwich it between the molds and heat it to remove dirt.

It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.

A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.

A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.

Almic-Can is a food container made from laminated aluminum foil and resin sheets. This container can thus contribute to solving the issue of food waste and reducing plastic consumption.

It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.

Example of using WelQuick. Strong adhesion can be obtained simply by placing the film on the joints of the substrates in the Roll to Roll process such as FPC and heat-sealing them.

Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs.

Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.

We finally achieved direct-bonding of metal with thermoplastic and thermosetting resins. They are expected to reduce the production process time and downsize the products.