Base Materials for PWBs

Copper Foil for Fine Patterning – PF-EL

Product Information and Application

Product form

  • Copper Foil: PF-EL

Applications

  • Semiconductor package substrates
  • High density multi-layer PWB

Features

  • PF-EL is a copper foil that is appropriate for fine line patterning with semi-additive process (SAP) using rough shapes of primer made with the copper profile.
  • PF-EL has high peel strength for plating copper.
  • High flexural modulus substrates with using prepregs.

Characteristics

Surface

Copper Foil for Fine Patterning - PF-EL

PF-EL

Copper Foil for Fine Patterning - PF-EL

PF-EL SP

Fine patterning with SAP

Copper Foil for Fine Patterning - PF-EL

Design
L/S=10/10 µm with PF-EL
(Exposure LDⅠ)

Copper Foil for Fine Patterning - PF-EL

Design
L/S=7/7 µm with PF-EL SP
(Exposure LDⅠ)

Copper Foil for Fine Patterning - PF-EL

Design
L/S=5/5 µm with PF-EL SP
(Exposure Stepper)

Copper peel strength

Copper Foil for Fine Patterning - PF-EL

*Sample: MCL-E-770G (Type R), Copper foil 1.5 µm with plating copper 20 µm

Plating copper peel strength

Copper Foil for Fine Patterning - PF-EL

*Sample: MCL-E-770G (Type R), plating copper 20 µm

Fine patterning process

Copper Foil for Fine Patterning - PF-EL
Copper Foil for Fine Patterning - PF-EL

Standard Specifications

Copper Foil

Part Number Copper Foil
Thickness (µm)
Special Surface
Treatment (µm)
Roughness (µm) Composition Process
PF-EL-12 12 4 Ra: 0.3–0.4 Copper Foil for Fine Patterning - PF-EL SAP *1
Rz: 1.5–2.5
PF-EL-3 3 2, 4 Ra: 0.3–0.5 SAP *1
MSAP *2
Rz: 1.5–2.5
PF-EL-2 2 2, 4 Ra: 0.3–0.5
Rz: 1.5–2.5
PF-EL-1.5 1.5 2 Ra: 0.3–0.5
Rz: 1.5–2.5
PF-EL-1.5SP 1.5 2 Ra: 0.2–0.3
Rz: 1.0–2.0

*1) After lamination of the material to the prepreg, the copper foil is etched out,and the special surface treatment with appropriate roughness made by a replica of the copper profile etched out remains on prepreg surface.This process is SAP using this replica.
*2) Semi additive process using thin copper foil as seed layer for having E’less copper +copper on both patterming and via plating purpose.