Base Materials for PWBs
Surface Smoothness of Prepreg (Microscope)
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
Laminate condition (Sample)
Undulation of prepreg after press (GEA-705G1010F78)
*1) Heating Rate: 10℃/min., *2) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.
*1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.
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