Base Materials for PWBs
Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F)
Product Information and Application
Product form
- Prepreg: GEA-705G (Type F), GEA-770G (Type F)
Applications
- Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
- HDI, PWB
- Thinner module, PWB
Features
- Superior in impedance control as prepreg thickness variation is small after press.
- Suitable for fine line formation with its smooth surface.
- Can achieve insulation layer thickness 16 µm.
- Suitable for coreless structure by superior variation of dimensional change.
- Undulation of (Type F) prepreg is small after press and warpage can be reduced at assembly.
Characteristics
Surface Smoothness of Prepreg (Microscope)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-1.png)
(Type F)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-2.png)
Conventional
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-3.png)
(Type F)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-4.png)
Conventional
Laminate condition (Sample)
- GEA-705G 1010F78
- Copper foil: 3 µm
- Temp.: 230℃100min
- Heating rate: 3.0℃/min
- Pressure: 3MPa
Measurement method
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-5.png)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-6.png)
Undulation of prepreg after press (GEA-705G1010F78)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-7.jpeg)
(Type F)
![Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F) Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)](https://am.resonac.com/wp-content/uploads/2022/11/gea-705g-gea-770g-type-f-8.jpeg)
Conventional
Prepreg
Item | Condition *2 | Unit | Actual Value | Test Method | ||
---|---|---|---|---|---|---|
GEA-705G (Type F) | GEA-770G (Type F) | (IPC-TM-650) | ||||
Tg | TMA method | A | ℃ | 250–270 | 260–280 | 2.4.24.5 |
DMA method | A | 295–305 | 300–330 | – | ||
CTE *1 (Pull) | X (30–120℃) | A | ppm/℃ | 8–10 | 6–7 | 2.4.24.5 |
Y (30–120℃) | 2–5 | 2–4 | ||||
T260 (Without Copper) | A | min. | >60 | >60 | 2.4.24.1 | |
T288 (Without Copper) | >60 | >60 | ||||
Undulation (After Press) | A | mm | 0.0–0.3 | 0.0–0.3 | – |
*1) Heating Rate: 10℃/min., *2) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.
Standard Specifications
Prepreg
Part Number | Type | Glass Cloth | Properties | |||
---|---|---|---|---|---|---|
Style | Resin Content (%) |
Dielectric Thickness after Lamination *1 (mm) |
||||
GEA-705G | (F) | 0.020 | 1010F74 | 1010 | 74±2 | 0.021 |
1010F76 | 76±2 | 0.023 | ||||
1010F78 | 78±2 | 0.025 | ||||
1010F80 | 80±2 | 0.027 | ||||
1010F84 | 84±2 | 0.035 | ||||
0.025 | 1017F73 | 1017 | 73±2 | 0.025 | ||
1017F78 | 78±2 | 0.031 | ||||
1017F83 | 83±2 | 0.040 | ||||
GEA-770G | (F) | 0.020 | 1010F67 | 1010 | 67±2 | 0.016 |
1010F69 | 69±2 | 0.018 | ||||
1010F71 | 71±2 | 0.019 | ||||
1010F73 | 73±2 | 0.021 | ||||
1010F78 | 78±2 | 0.026 | ||||
1010F82 | 82±2 | 0.032 | ||||
0.025 | 1017F73 | 1017 | 73±2 | 0.026 | ||
1017F78 | 78±2 | 0.033 | ||||
1017F83 | 83±2 | 0.043 | ||||
0.030 | 1027F73 | 1027 | 73±2 | 0.042 | ||
1027F78 | 78±2 | 0.052 | ||||
Reference (IPC-TM-650) | 2.3.16 | ‐ |
*1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.