CMP Slurry
FEOL Application
Showa Denko Materials is a leading company of CeO2 slurry for STI. “GPX” shows excellent polishing performance and it is suitable for finer patterns.
Features
- Free form scratches by using tuned CeO2 particles.
- High removal rate at low slurry content (CeO2:1%).
- High planarization and selectivity between SiO2 and Si3N 4.
- Unnecessary for conventional etch back process.
CMP Process
Advanced semiconductor devices with high performance are required to have multi-level layers, fine patterns to obtain high speed transmission. CMP process is indespensable to have well-planarized interlayer dielectric or metals in LSI and accomplish the above requirements.
Characteristics (Typical Values)
| Item | Unit | HS-8005 series + HS-8102GP |
HS-8005 series + HS-7303GP |
HS-9000 series | SiO2 slurry |
|---|---|---|---|---|---|
| Features | — | High planarization | Low scratch | Good workability | — |
| Supply form | — | 2 components | 2 components | 1 component | 1 component |
| Residual step height | nm | 50 | 10 | 10 | 200 |
| Automatic stop on Si3N4 | — | Available | Available | Available | Available |