Base Materials for PWBs

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material – MCL-HS200

Product Information and Application

Product form

  • CCL: MCL-HS200
  • Prepreg: GH-200

Applications

  • Semiconductor packages. (FC-CSP, PoP, SiP)
  • Thinner Module PWB

Features

  • MCL-HS200 has hybrid properties of package and high speed materials.
  • MCL-HS200 has low CTE value in X, Y directions and good dielectric property (Dk 3.7, Df 0.0040 at 10GHz).
  • MCL-HS200(D) achieved low dielectric constant (3.4 at 10GHz) and low dissipation factor (0.0025 at 10GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of 4 layer board

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS200

TEG Chip

  • Chip size 10mm×10mm
  • Chip thickness 100 µm

TEG Substrate

  • Package size 14mm×14mm
  • L1, 4: 12 µm Cu: 65%, L2, 3No Copper SR: 18 µm
  • Core thickness: 45 µm
  • Prepreg thickness: 45 µm
Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS200

Transmission Loss

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS200

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperture and Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50Ω
  • Proofreading method: TRL(Thru-Reflect-Line)
Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS200
  • Trace width(w): 0.12–0.14mm
  • Dielectric thickness(b): 0.65mm
  • Trace thickness(t): 18 µm

Thin Laminate

(t0.2, t0.4mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS200 MCL-HS200 (Type D)
Tg TMA method A 220–240 2.2.24
DMA method A 250–270
CTE *1 X (30–120℃) A ppm/℃ 8–10
Y (30–120℃) A 8–10
Z <Tg A 25–35 2.2.24
>Tg 140–200
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without copper) A min. >60 2.4.24.1
T-288 (Without copper) A >60
Decomposition Temperature (TGA method 5% weight loss) A 410–430 2.3.40
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.2.8
18 µm A 0.8–1.0
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 21–26 2.4.4
Dielectric Constant 10GHz *2 A 3.6–3.8 3.2–3.4 IEC-62810
Dissipation Factor 10GHz *2 A 0.0035–0.0045 0.0020–0.0030
Volume Resistivity C-96/20/65+C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/20/65+C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance C-96/20/65 Ω 1×1014–1×1016
C-96/20/65+D-2/100 1×1013–1×1014

*1) Heating Rate: 10℃/min., *2) Measured by cavity resonator., *3) Refer to “Condition Note
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS200 3,12, µm
(LP, HVLP)
U0.04 0.04mm
3 µm
12 µm
18 µm
(LP, RT, HVLP)
M0.06 0.06mm
0.1 0.10mm
0.2 0.20mm
0.41 0.41mm
(D) 3,12, µm
(LP, HVLP)
DU0.04 0.04mm
3 µm
12 µm
18 µm
(LP, RT, HVLP)
DM0.06 0.06mm
D0.1 0.10mm
D0.2 0.20mm
D0.41 0.41mm

Note1) Std: Standard copper foil, LP/HVLP: Low profile copper foil.
Note2) LP: 3 µm, 12 µm, HVLP: 12 µm, 18 µm.
Note3) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass cloth Properties
Style Resin content
(%)
Dielectric Thickness
after Lamination *1 (mm)
GH-200 (DF) 0.025 (See [GH-200 (Type DF)]page for ultra thin, flat prepregs)
0.03 (1027N71) 1027 71±2 0.039
0.03 (1027N77) 1027 77±2 0.051
0.05 (1037N73) 1037 73±2 0.051
0.05 (1037N77) 1037 77±2 0.061
0.06 (1078N63) 1078 63±2 0.073
0.06 (1078N73) 1078 73±2 0.082
0.08 (3313N60) 3313 60±2 0.11
(D) 0.03 (D1027N74) 1027 74±2 0.041
0.03 (D1027N78) 1027 78±2 0.049
0.05 (D1035N69) 1037 69±2 0.051
0.05 (D1035N73) 1037 73±2 0.059
0.06 (D1078N65) 1078 65±2 0.072
0.06 (D1078N69) 1078 69±2 0.083
0.08 (D3313N62) 3313 62±2 0.108
Reference (IPC-TM-650) 2.3.16

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.