Photosensitive Materials for PWBs

SR7300 / SR-F Series

Product Information and Application

Photosensitive Solder Resist - SR7300 / SR-F Series

Photosensitive solder resist, SR7300/SR-F, are optimized for package substrate.

Features

  • Low warpage by low CTE and low shrinkage, contributing to assembly and excellent reliability (HAST, TCT crack and Reflow resistance) of semiconductor PKG substrates.
  • Excellent resolution, contributing to higher functionality and miniaturization of semiconductor PKG substrates.
  • SR7300 is liquid type solder resist, SR-F is film type solder resist.
(One of our data)

Item Condition Unit SR7300
SR-F
Resolution 20 µm thickness µmΦ 50
Tg TMA 130 -140
CTE α1 ppm/℃ 38
Elastic modulus DMA, 23℃ MPa 5,000
Tensile strength S-S, 23℃ MPa 95
Elongation S-S, 23℃ % 4.2
Adhesion with copper 90°peel
(on CZ treatment)
N/m >0.6
Td (5% weight loss) TG-DTA 346

* Available upon request for film thickness

Thermal Cycle Test

TEST vehicle
Photosensitive Solder Resist - SR7300 / SR-F Series
Reflow 10 times After 1000 cycle After 2000 cycle After 3000cycle
Continuity
check
CSAM Continuity
check
CSAM Continuity
check
CSAM Continuity
check
CSAM
SR7300 / SR-F Pass Pass Pass Pass Pass Pass Pass Pass
conventional Pass Pass Pass Pass Pass Pass NG NG

*CSAM:Constant-depth mode Scanning Acoustic Microscope