Epoxy Molding Compounds

for Lead Frame

Showa Denko Materials has a top-level market share in epoxy molding compounds. Our products meet the customers’ demands and the changes of package trends.

Features

Applications

  • Excellent moisture resistance and heat shock resistance.
  • Excellent reflow crack resistance.

DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.

Characteristics

Item Unit CEL-1620 HF16 CEL-1620 HF17 CEL-9200 HF10 CEL-9240 HF10 CEL-9200
HF9
 Applications DIP DIP QFP, SOP QFN, PLCC QFN
 Flame retardant type Metal hydroxide Metal hydroxide No flame retardant No flame retardant Organic phosphorous
 Spiral flow cm 120 80 100 100 110
 Tg °C 155 150 125 110 110
 CTE  a1 ppm/°C 19 19 8 7 8
 a2 ppm/°C 64 64 33 28 32
 Flexural modulus GPa 16 14 27 33 27
 Mold shrinkage % 0.45 0.55 0.17 0.16 0.22

Process