Base Materials for PWBs

Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material – MCL-E-78G

Product Information and Application

Product form

  • CCL: MCL-E-78G
  • Prepreg: GEA-78G

Applications

  • Smartphone.
  • Tablet PC.

Features

  • Halogen-free with low dielectric property. (Dk 3.5(@1GHz, Resin content. = 70%))
  • High Tg and elastic modulus is higher than that of standard FR-4 at high temperature.
  • Superior heat resistance. (Suitable for lead free process)

Characteristics

Correlation between Dielectric Constant and Frequency

Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material - MCL-E-78G

Note 1) Measured by Triplate-line Resonator.

Elastic Modulus

Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material - MCL-E-78G

Correlation between Dissipation Factor and Frequency

Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material - MCL-E-78G

Thin Laminate

(t0.8mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
78G
Tg TMA method A 160–170 2.4.24
DMA method A 200–220
CTE *1 X (30–120℃) A ppm/℃ 13–15
Y (30–120℃) 15–17
Z (<Tg) A 35–45 2.4.24
(>Tg) A 180–230
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without Copper) A min. >60 2.4.24.1
T-288 (Without Copper)
Decomposition Temperature (TGA method 5% Weight Loss) A 380–400 2.3.40
Copper Peel Strength 18 µm A kN/m 1.0–1.2 2.4.8
35 µm 1.1–1.3
Flexural Modulus (Lengthwise) A GPa 23–29 2.4.4
Dielectric Constant *2
(R.C.: 70%)
1GHz A 3.4–3.6 JPCA TM-001
10GHz 3.3–3.5
 Dissipation Factor *2
(R.C.: 70%)
1GHz A 0.009–0.011
10GHz 0.012–0.014
Volume Resistivity C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016
D-2/100 1×1012–1×1014

*1) Heating Rate: 10℃/min., *2) Measured by Triplate-Line Resonator., *3) Refer to “Condition Note
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate thickness
MCL-E-78G 12, 18, 35 µm 0.04 0.04mm
0.05 0.05mm
0.06 0.06mm
12 µm
18 µm
35 µm
70 µm
0.07 0.07mm
0.08 0.08mm
0.09 0.09mm
0.1 0.10mm
0.15 0.15mm

Note 1) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)
Dielectric Thickness
after Lamination *1 (mm)
GEA-78G 0.03 (1027N72) 1027 72±2 0.044
0.04 (106N70) 106 70±2 0.051
0.04 (106N72) 106 72±2 0.056
0.04 (1037N70) 1037 70±2 0.049
0.04 (1037N74) 1037 74±2 0.058
0.05 (1067N69) 1067 69±2 0.061
0.05 (1067N72) 1067 72±2 0.069
0.06 (1080N62) 1080 62±2 0.075
0.06 (1078N62 1078 62±2 0.075
Reference (IPC-TM-650) 2.3.16

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.