Photosensitive Materials for PWBs
RY Series for PKG Board
Product Information
![ry-series-for-pkg-board-1 Photosensitive Dry Film "PHOTEC" RY Series for PKG Board](https://am.resonac.com/wp-content/uploads/2022/11/ry-series-for-pkg-board-1.jpeg)
RY series are aqueous type photosensitive films used for high density semiconductor package such as BGA, CSP and so forth. RY-5100 series have excellent adhesion and resolution and less resist foot and the other advantage.
Features
- These films are suitable for semi-additive process with high adhesion, high resolution and stable line width.
- Shorter resist foot can contribute to finer pattern manufacturing. Excellent resist profile (smooth resist side wall) results in smooth plating line profile.
Photo characteristics (One of our data)
Item | Unit | RY-5115 | RY-5125 |
---|---|---|---|
Resist thickness | µm | 15 | 25 |
Exposure energy | mJ/cm2 | 130 | 130 |
Adhesion (L/S=x/3x) | µm | 4 | 7 |
Resolution (L/S=x/x) | µm | 6 | 7 |
![Photosensitive Dry Film “PHOTEC” RY Series for PKG Board Photosensitive Dry Film "PHOTEC" RY Series for PKG Board](https://am.resonac.com/wp-content/uploads/2022/11/ry-series-for-pkg-board-2.jpeg)
RY-5115 (L/S=10 µm/10 µm)
![Photosensitive Dry Film “PHOTEC” RY Series for PKG Board Photosensitive Dry Film "PHOTEC" RY Series for PKG Board](https://am.resonac.com/wp-content/uploads/2022/11/ry-series-for-pkg-board-3.jpeg)
RY-5125 (L/S=10 µm/10 µm)