Base Materials for PWBs

Low Loss Adhesive Film – AS-400HS/MCF-400HS

Product Information and Application

Product form

  • Adhesive Film: AS-400HS
  • Resin Coated Copper: MCF-400HS

Applications

  • Antena use
  • High-Speed PCB

Features

  • Excellent dielectric properties (Low transmission loss)
  • Adaptable to multi layer press process.
  • Good adhesion to PTFE
  • Adaptable to interlaminate connection by laser IVH

Standard Specifications

Part Number Type Actual Thickness Carrier Film Thickness
AS-400HS 25 µm, 50 µm, 65 µm 50 µm (PET)
MCF-400HS 25 µm, 50 µm, 65 µm 12 µm, 18 µm (Cu foil;HVLP)

Characteristics

Transmission Loss

Low Loss Adhesive Film - AS-400HS/MCF-400HS

Measurement Conditions

  • Transmission structure: Micro-strip-line
  • Temperature & Humidity: 25℃/40%RH
  • Characteristic impedance: 50Ω
  • Calibration method: TRL
Low Loss Adhesive Film - AS-400HS/MCF-400HS
  • Line width(w): 240–270 µm
  • Dielectric thickness(b): 100–130 µm
  • Copper thickness (t): 30 µm (include plating)

Cross section of laser-via

Low Loss Adhesive Film - AS-400HS/MCF-400HS

C-stage

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
AS-400HS/MCF-400HS
Storage Modulus (DMA method: 25℃) A Gpa 3–5
Tg (DMA method) A 190–250
CTE *1 Z (<Tg) A ppm/℃ 20–45 2.4.24
(>Tg) A 35–75
Solder Heat Resistance (260℃) A sec. >300
Copper Peel Strength 18 µm HVLP A kN/m 0.45–0.60 2.4.8
Dielectric Constant 10GHz *2 A 2.9–3.1 IEC-62810
Dissipation Factor 10GHz *2 A 0.0020–0.0030

*1) Heating Rate: 10℃/min. (. Compression), *2) Measured by cavity resonator., *3) Refer to “Condition Note

B-stage

Item Condition Unit Actual Value Reference
Volatile Content 180℃ 5min. weight method wt% <2