Base Materials for PWBs
Low Loss Adhesive Film – AS-400HS/MCF-400HS
Product Information and Application
Product form
- Adhesive Film: AS-400HS
- Resin Coated Copper: MCF-400HS
Applications
- Antena use
- High-Speed PCB
Features
- Excellent dielectric properties (Low transmission loss)
- Adaptable to multi layer press process.
- Good adhesion to PTFE
- Adaptable to interlaminate connection by laser IVH
Standard Specifications
| Part Number | Type | Actual Thickness | Carrier Film Thickness |
|---|---|---|---|
| AS-400HS | － | 25 µm, 50 µm, 65 µm | 50 µm (PET) |
| MCF-400HS | － | 25 µm, 50 µm, 65 µm | 12 µm, 18 µm (Cu foil;HVLP) |
Characteristics
Transmission Loss
Measurement Conditions
- Transmission structure: Micro-strip-line
- Temperature & Humidity: 25℃/40%RH
- Characteristic impedance: 50Ω
- Calibration method: TRL
- Line width(w): 240–270 µm
- Dielectric thickness(b): 100–130 µm
- Copper thickness (t): 30 µm (include plating)
Cross section of laser-via
C-stage
| Item | Condition *3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| AS-400HS/MCF-400HS | ||||||
| Storage Modulus (DMA method: 25℃) | A | Gpa | 3–5 | ‐ | ||
| Tg (DMA method) | A | ℃ | 190–250 | ‐ | ||
| CTE *1 | Z | (＜Tg) | A | ppm/℃ | 20–45 | 2.4.24 |
| (＞Tg) | A | 35–75 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | ‐ | ||
| Copper Peel Strength | 18 µm HVLP | A | kN/m | 0.45–0.60 | 2.4.8 | |
| Dielectric Constant | 10GHz *2 | A | － | 2.9–3.1 | IEC-62810 | |
| Dissipation Factor | 10GHz *2 | A | － | 0.0020–0.0030 | ||
*1) Heating Rate: 10℃/min. (. Compression), *2) Measured by cavity resonator., *3) Refer to “Condition Note”
B-stage
| Item | Condition | Unit | Actual Value | Reference |
|---|---|---|---|---|
| Volatile Content | 180℃ 5min. weight method | wt% | <2 | ‐ |