Base Materials for PWBs

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material – MCL-HE-679G (Type S)

Product Information and Application

Product form

  • CCL: MCL-HE-679G (Type S)
  • Prepreg: GHA-679G (Type S)

Applications

  • Network applications.
  • High-frequency parts. (filters, VCOs, etc.)

Features

  • Enables lower transmission loss than MCL-HE-679G with lower dissipation factor.
  • High Tg and superior heat resistance for soldering. (Suitable for lead free process)
  • CTE in Z-direction is 30% lower than that of our standard FR-4.
  • Achieved UL 94V-O flammability standard without using any compound which includes halogen, antimony or red phosphorous.

Characteristics

Correlation between Dielectric Constant and Frequency

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)

Correlation between Dissipation Factor and Frequency

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)

Transmission Loss

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)

Thin Laminate

(t0.8mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-HE-679G (Type S)
Tg TMA method A 180–190 2.4.24
DMA method A 260–280
CTE *1 X (30–120℃) A ppm/℃ 12–15
Y (30–120℃) A 14–17
*4 (<Tg) A 30–40 2.4.24
(>Tg) 190–230
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without Copper) A min. >60 2.4.24.1
T-288 (Without Copper) A >60
Decomposition Temperature (TGA method 5% Weight Loss) A 370–390 2.3.40
Copper Peel Strength (RT) 18 µm A kN/m 0.5–0.7 2.4.8
35 µm A 0.6–0.8
Flexural Modulus (Lengthwise) A GPa 23–26 2.4.4
Dielectric Constant 1GHz *2 A 3.70–3.90 JPCA TM-001
10GHz *2 A 3.6–3.8
Dissipation Factor 1GHz *2 A 0.0060–0.0080
10GHz *2 A 0.007–0.009
Volume Resistivity C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016
D-2/100 1×1012–1×1014

*1) Heating Rate: 10℃/min., *2) Measured by Triplate-line Resonator., *3) Measured by Material Analyzer., *4) Refer to “Condition Note
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HE-679G (S) 12 µm
18 µm
35 µm
70 µm
0.06 0.06mm
0.08 0.08mm
0.1 0.10mm
0.15 0.15mm
0.2 0.20mm
0.4 0.40mm
0.6 0.60mm
0.8 0.80mm

Note 1) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)
Dielectric Thickness
after Lamination *1 (mm)
GHA-679G 0.04 (S1037N72) 1037 72±2 0.053
0.06 (S1080N64) 1080 64±2 0.080
0.06 (S1080N69) 1080 69±2 0.095
0.06 (S1078N64) 1078 64±2 0.078
0.08 (S3313N56) 3313 56±2 0.105
0.08 (S3313N62) 3313 62±2 0.126
0.1 (S2116N54) 2116 54±2 0.128
0.1 (S2116N60) 2116 60±2 0.152
Reference (IPC-TM-650) 2.3.16

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.