Base Materials for PWBs
Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material – MCL-HE-679G (Type S)
Product Information and Application
Product form
- CCL: MCL-HE-679G (Type S)
- Prepreg: GHA-679G (Type S)
Applications
- Network applications.
- High-frequency parts. (filters, VCOs, etc.)
Features
- Enables lower transmission loss than MCL-HE-679G with lower dissipation factor.
- High Tg and superior heat resistance for soldering. (Suitable for lead free process)
- CTE in Z-direction is 30% lower than that of our standard FR-4.
- Achieved UL 94V-O flammability standard without using any compound which includes halogen, antimony or red phosphorous.
Characteristics
Correlation between Dielectric Constant and Frequency
![Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material – MCL-HE-679G (Type S) Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)](https://am.resonac.com/wp-content/uploads/2022/11/mcl-he-679g-type-s-1.png)
Correlation between Dissipation Factor and Frequency
![Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material – MCL-HE-679G (Type S) Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)](https://am.resonac.com/wp-content/uploads/2022/11/mcl-he-679g-type-s-2.png)
Transmission Loss
![Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material – MCL-HE-679G (Type S) Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material - MCL-HE-679G (Type S)](https://am.resonac.com/wp-content/uploads/2022/11/mcl-he-679g-type-s-3.png)
Thin Laminate
(t0.8mm)
Item | Condition *3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
---|---|---|---|---|---|---|
MCL-HE-679G (Type S) | ||||||
Tg | TMA method | A | ℃ | 180–190 | 2.4.24 | |
DMA method | A | 260–280 | ‐ | |||
CTE *1 | X (30–120℃) | A | ppm/℃ | 12–15 | ‐ | |
Y (30–120℃) | A | 14–17 | ||||
Z *4 | (<Tg) | A | 30–40 | 2.4.24 | ||
(>Tg) | 190–230 | |||||
Solder Heat Resistance (260℃) | A | sec. | >300 | ‐ | ||
T-260 (Without Copper) | A | min. | >60 | 2.4.24.1 | ||
T-288 (Without Copper) | A | >60 | ||||
Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 370–390 | 2.3.40 | ||
Copper Peel Strength (RT) | 18 µm | A | kN/m | 0.5–0.7 | 2.4.8 | |
35 µm | A | 0.6–0.8 | ||||
Flexural Modulus (Lengthwise) | A | GPa | 23–26 | 2.4.4 | ||
Dielectric Constant | 1GHz *2 | A | ‐ | 3.70–3.90 | JPCA TM-001 | |
10GHz *2 | A | 3.6–3.8 | ||||
Dissipation Factor | 1GHz *2 | A | ‐ | 0.0060–0.0080 | ||
10GHz *2 | A | 0.007–0.009 | ||||
Volume Resistivity | C-96/40/90 | Ω・cm | 1×1014–1×1016 | 2.5.17 | ||
Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | |||
Insulation Resistance | A | Ω | 1×1014–1×1016 | ‐ | ||
D-2/100 | 1×1012–1×1014 | ‐ |
*1) Heating Rate: 10℃/min., *2) Measured by Triplate-line Resonator., *3) Measured by Material Analyzer., *4) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
Part Number | Type | Copper Foil Thickness | Code Name | Laminate Thickness |
---|---|---|---|---|
MCL-HE-679G | (S) | 12 µm 18 µm 35 µm 70 µm |
0.06 | 0.06mm |
0.08 | 0.08mm | |||
0.1 | 0.10mm | |||
0.15 | 0.15mm | |||
0.2 | 0.20mm | |||
0.4 | 0.40mm | |||
0.6 | 0.60mm | |||
0.8 | 0.80mm |
Note 1) The thickness means that of dielectric layer.
Prepreg
Part Number | Type | Glass Cloth | Properties | ||
---|---|---|---|---|---|
Style | Resin Content (%) |
Dielectric Thickness after Lamination *1 (mm) |
|||
GHA-679G | 0.04 | (S1037N72) | 1037 | 72±2 | 0.053 |
0.06 | (S1080N64) | 1080 | 64±2 | 0.080 | |
0.06 | (S1080N69) | 1080 | 69±2 | 0.095 | |
0.06 | (S1078N64) | 1078 | 64±2 | 0.078 | |
0.08 | (S3313N56) | 3313 | 56±2 | 0.105 | |
0.08 | (S3313N62) | 3313 | 62±2 | 0.126 | |
0.1 | (S2116N54) | 2116 | 54±2 | 0.128 | |
0.1 | (S2116N60) | 2116 | 60±2 | 0.152 | |
Reference (IPC-TM-650) | 2.3.16 | ‐ |
*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.