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Kei Tozawa
2023-03-01T22:21:42+00:00
News Archive
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3M Joins the US-JOINT Consortium for Next-Generation Semiconductor Packaging
Release Date:02/04/2025
Resonac Transfers Shares in Its Subsidiary Handling Secondary Battery Packaging Materials and Food Packaging Materials
Release Date:02/03/2025
Resonac’s Technology for Directly Recycling Mixed Plastic Wastes into Basic Chemicals Selected for NEDO’s Green Innovation Fund
Release Date:01/27/2025
Resonac Launches the Circular Business Model “CirculaC” for Used Plastics and Textiles
Release Date:01/20/2025
Crasus Chemical Decides to License Vinyl Acetate Monomer Production Technology to Yulin Chemical (China)
Release Date:01/14/2025
Resonac Develops New Photosensitive Film for Advanced Semiconductor Packages
Release Date:12/02/2024
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