Base Materials for PWBs

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material – MCL-E-770G (Type R)

Product Information and Application

Product form

  • CCL: MCL-E-770G (Type R)
  • Prepreg; GEA-770G

Applications

  • Semiconductor packages. (FC-CSP, PoP, SiP)
  • Thinner module.

Features

  • MCL-E-770G has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
  • MCL-E-770G (Type RLH) has lower CTE value (less than 2.0ppm/℃).

Characteristics

Warpage of FC-CSP

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-770G (Type R)

TEG Chip

  • Chip size: 7.3mm×7.3mm
  • Chip thickness: 150 µm
  • Underfill thickness: 60 µm (CEL-C-3730-4)
  • Solder Resist thickness: 20 µm (FZ-2700GA)

TEG Substrate

  • Package size: 14mm×14mm
  • Core Thickness 200 µm+1024 (S-HD) PPG
Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material MCL-E-770G (Type R)

Thin Laminate

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
770G (Type R)		 MCL-E-
770G (Type RLH)
Tg TMA method A ℃ 260–280 2.4.24
DMA method A 300–330 ‐
CTE *1 X (30–120℃) A ppm/℃ 4.0–6.0 1.5–2.0 ‐
Y (30–120℃) 4.0–6.0 1.5–2.0
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T260 (Without copper) A min. ＞60 2.4.24.1
T288 (Without copper) ＞60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 430–450 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycles ＞20 ‐
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.4.8
18 µm 0.8–1.0
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) *4 A GPa 30–32 34–36 ‐
Dielectric Constant 10GHz *2 A － 4.2–4.4 3.9–4.1 IEC-61189-2-721
Dissipation Factor 10GHz *2 A － 0.006–0.008 0.006–0.008 IEC-61189-2-721
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐

*1) Heating Rate: 10℃/min., *2) Measured by SPDR., *3) Refer to “Condition Note“, *4) t0.8mm

t0.4mm thickness core is used depending on test item.
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-E-770G (R) 2 µm
3 µm
12 µm
(LP, PF)		 T0.05 0.05mm
U0.04 0.04mm
2 µm
3 µm
12 µm
(STD, LP, PF)		 M0.06 0.06mm
0.1 0.11mm
HD0.15 0.16mm
0.2 0.21mm
(RLH) 2 µm
3 µm
12 µm
18 µm
(STD, LP, PF)		 U0.04 0.04mm
M0.06 0.06mm
0.1 0.11mm
D0.15 0.16mm
0.31 0.31mm

Note1) STD: Standard copper foil, LP: Low profile copper foil, PF: Profile free copper foil.
Note2) STD: 12 µm, 18 µm; LP: 2 µm, 3 µm, 12 µm, 18 µm.
Note3) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one.
Note4) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GEA-770G (F) ≦0.025 (See [GEA-770G (Type F)] page for ultra thin, flat prepregs)
‐ 0.025 (1017N72) 1017 72±2 0.025
0.025 (1017N76) 1017 76±2 0.030
0.03 (1027N72) 1027 72±2 0.040
0.03 (1027N76) 1027 76±2 0.048
0.04 (1037N72) 1037 72±2 0.048
(L) 0.025 (L1017N72) 1017 72±2 0.025
0.025 (L1017N76) 1017 76±2 0.030
0.03 (L1027N72) 1027 72±2 0.040
0.03 (L1027N76) 1027 76±2 0.048
0.035 (L1024N68) 1024 68±2 0.041
0.035 (L1024N73) 1024 73±2 0.050
0.04 (L1037N72) 1037 72±2 0.048
0.045 (L1030N71) 1030 71±2 0.058
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.