Die Bonding Film
UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.
- Realizable fine pitch interconnection only with the application of heat and pressure.
- Unnecessary for underfill.
- Stress reduction between a chip and a substrate.
- 2 types are available: one with and one without conductive particles.
Characteristics (Typical Values)
|Die bonding condition||Temp.||°C||180||180||—|
|Elastic modulus (40)||GPa||6.6||6.6||DMA|