Photosensitive Materials for PWBs
SR7300 / SR-F Series
Product Information and Application
Photosensitive solder resist, SR7300/SR-F, are optimized for package substrate.
Features
- Low warpage by low CTE and low shrinkage, contributing to assembly and excellent reliability (HAST, TCT crack and Reflow resistance) of semiconductor PKG substrates.
- Excellent resolution, contributing to higher functionality and miniaturization of semiconductor PKG substrates.
- SR7300 is liquid type solder resist, SR-F is film type solder resist.
(One of our data)
| Item | Condition | Unit | SR7300 SR-F |
|---|---|---|---|
| Resolution | 20 µm thickness | µmΦ | 50 |
| Tg | TMA | ℃ | 130 -140 |
| CTE | α1 | ppm/℃ | 38 |
| Elastic modulus | DMA, 23℃ | MPa | 5,000 |
| Tensile strength | S-S, 23℃ | MPa | 95 |
| Elongation | S-S, 23℃ | % | 4.2 |
| Adhesion with copper | 90°peel (on CZ treatment) |
N/m | >0.6 |
| Td (5% weight loss) | TG-DTA | ℃ | 346 |
* Available upon request for film thickness
Thermal Cycle Test
TEST vehicle |
Reflow 10 times | After 1000 cycle | After 2000 cycle | After 3000cycle | ||||
|---|---|---|---|---|---|---|---|---|
| Continuity check |
CSAM | Continuity check |
CSAM | Continuity check |
CSAM | Continuity check |
CSAM | |
| SR7300 / SR-F | Pass | Pass | Pass | Pass | Pass | Pass | Pass | Pass |
| conventional | Pass | Pass | Pass | Pass | Pass | Pass | NG | NG |
*CSAM:Constant-depth mode Scanning Acoustic Microscope