Photosensitive Materials for PWBs

RD Series for Direct Imaging

Product Information and Application

Photosensitive Dry Film "PHOTEC" - RD Series for Direct Imaging

RD series are fully aqueous applicable photosensitive films used for direct imaging system. These series have high photosensitivity, high resolution, excellent imaging property and other advantages then conventional films.

Features

  • RD-3000 series have excellent adhesion and resolution, make it suitable for fine pattern manufacturing by plating.
  • It is used for digital light processing (DLP) system and UV laser direct imaging (UV-LDI) system both.
  • Because of high imaging property, it is able to confirm the exposed area.
Photo characteristics (One of our data)

Item Unit RD-3015 RD-3019 RD-3025
Resist thickness µm 15 19 25
Exposure energy mJ/cm2 95 95 85
Recommended step held x/41ST 15 15 15
Adhesion (L/S=x/3x) µm 4 5 7
Resolution (L/S=x/x) µm 4 5 7
  • DE-1 UH was applied(Adtec Engineering Co.,Ltd, 405 nmDI)
  • Substrate roughness Ra:0.4 µm
  • Post exposure bake (P.E.B) : 80 degree C, 30 Sec. (Box Oven)
  • Developer : 1.0 wt% Na2CO3aq., 30 degree C, 0.16 MPa

Resist Profile

Photosensitive Dry Film "PHOTEC" - RD Series for Direct Imaging

RD-3015 (L/S=4 µm /4 µm)

Photosensitive Dry Film "PHOTEC" - RD Series for Direct Imaging

RD-3019 (L/S=5 µm/5 µm)

Photosensitive Dry Film "PHOTEC" - RD Series for Direct Imaging

RD-3025 (L/S=7 µm/7 µm)