High Purity Gas

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High Purity Gas

Etching and Cleaning Gases

Item Unit HS-H635 HS-T605 HS-T815
 Use for Cu for TaN Non selective
 Features Abrasive free like High removal @low down force High selective Non selective
 Removal Rate  Cu A/min. 8,000 250 480
 TaN 40 650 750
 SiO2 <50 650
 SiOC <50 200

Process content

Characteristics (Typical Values)

Item Unit HS-H635 HS-T605 HS-T815
 Use for Cu for TaN Non selective
 Features Abrasive free like High removal @low down force High selective Non selective
 Removal Rate  Cu A/min. 8,000 250 480
 TaN 40 650 750
 SiO2 <50 650
 SiOC <50 200