High Purity Gas
High Purity Gas
Etching and Cleaning Gases
| Item | Unit | HS-H635 | HS-T605 | HS-T815 | |
|---|---|---|---|---|---|
| Use | — | for Cu | for TaN | Non selective | |
| Features | — | Abrasive free like High removal @low down force | High selective | Non selective | |
| Removal Rate | Cu | A/min. | 8,000 | 250 | 480 |
| TaN | 40 | 650 | 750 | ||
| SiO2 | — | <50 | 650 | ||
| SiOC | — | <50 | 200 | ||
Process content
Characteristics (Typical Values)
| Item | Unit | HS-H635 | HS-T605 | HS-T815 | |
|---|---|---|---|---|---|
| Use | — | for Cu | for TaN | Non selective | |
| Features | — | Abrasive free like High removal @low down force | High selective | Non selective | |
| Removal Rate | Cu | A/min. | 8,000 | 250 | 480 |
| TaN | 40 | 650 | 750 | ||
| SiO2 | — | <50 | 650 | ||
| SiOC | — | <50 | 200 | ||