Base Materials for PWBs
Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material – MCL-E-78G
Product Information and Application
Product form
- CCL: MCL-E-78G
- Prepreg: GEA-78G
Applications
- Smartphone.
- Tablet PC.
Features
- Halogen-free with low dielectric property. (Dk 3.5(@1GHz, Resin content. = 70%))
- High Tg and elastic modulus is higher than that of standard FR-4 at high temperature.
- Superior heat resistance. (Suitable for lead free process)
Characteristics
Correlation between Dielectric Constant and Frequency
Note 1) Measured by Triplate-line Resonator.
Elastic Modulus
Correlation between Dissipation Factor and Frequency
Thin Laminate
(t0.8mm)
| Item | Condition *3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-E- 78G |
||||||
| Tg | TMA method | A | ℃ | 160–170 | 2.4.24 | |
| DMA method | A | 200–220 | ‐ | |||
| CTE *1 | X (30–120℃) | A | ppm/℃ | 13–15 | ‐ | |
| Y (30–120℃) | 15–17 | |||||
| Z | (＜Tg) | A | 35–45 | 2.4.24 | ||
| (＞Tg) | A | 180–230 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | ‐ | ||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | ||
| T-288 (Without Copper) | ||||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 380–400 | 2.3.40 | ||
| Copper Peel Strength | 18 µm | A | kN/m | 1.0–1.2 | 2.4.8 | |
| 35 µm | 1.1–1.3 | |||||
| Flexural Modulus (Lengthwise) | A | GPa | 23–29 | 2.4.4 | ||
| Dielectric Constant *2 (R.C.: 70%) |
1GHz | A | － | 3.4–3.6 | JPCA TM-001 | |
| 10GHz | 3.3–3.5 | |||||
| Dissipation Factor *2 (R.C.: 70%) |
1GHz | A | － | 0.009–0.011 | ||
| 10GHz | 0.012–0.014 | |||||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | |||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | ‐ | ||
| D-2/100 | 1×1012–1×1014 | ‐ | ||||
*1) Heating Rate: 10℃/min., *2) Measured by Triplate-Line Resonator., *3) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate thickness |
|---|---|---|---|---|
| MCL-E-78G | － | 12, 18, 35 µm | 0.04 | 0.04mm |
| 0.05 | 0.05mm | |||
| 0.06 | 0.06mm | |||
| 12 µm 18 µm 35 µm 70 µm |
0.07 | 0.07mm | ||
| 0.08 | 0.08mm | |||
| 0.09 | 0.09mm | |||
| 0.1 | 0.10mm | |||
| 0.15 | 0.15mm |
Note 1) The thickness means that of dielectric layer.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||
|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination *1 (mm) |
|||
| GEA-78G | 0.03 | (1027N72) | 1027 | 72±2 | 0.044 |
| 0.04 | (106N70) | 106 | 70±2 | 0.051 | |
| 0.04 | (106N72) | 106 | 72±2 | 0.056 | |
| 0.04 | (1037N70) | 1037 | 70±2 | 0.049 | |
| 0.04 | (1037N74) | 1037 | 74±2 | 0.058 | |
| 0.05 | (1067N69) | 1067 | 69±2 | 0.061 | |
| 0.05 | (1067N72) | 1067 | 72±2 | 0.069 | |
| 0.06 | (1080N62) | 1080 | 62±2 | 0.075 | |
| 0.06 | (1078N62 | 1078 | 62±2 | 0.075 | |
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||
*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.