Base Materials for PWBs

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material – MCL-HS100

Product Information and Application

Product form

  • CCL: MCL-HS100
  • Prepreg: GH-100

Applications

  • Semiconductor packages. (FC-CSP, PoP, SiP)
  • Thinner Module PWB

Features

  • MCL-HS100 has hybrid properties of package and high speed materials.
  • MCL-HS100 has low CTE value in X, Y directions and good dielectric property. (Dk 3.7, Df 0.0040 at 10GHz)
  • MCL-HS100(Type D) achieved low dielectric constant (3.4 at 10GHz) and low dissipation factor (0.0025 at 10GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of coreless-5 layer

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS100

TEG Chip

  • Package size: 14mm×14mm
  • Chip size: 7.3mm×7.3mm
  • Chip thickness: 150 µm
  • Underfill thickness: 60 µm (CEL-C-3730-4

TEG Substrate

  • L1, 5: 12 µm Cu100%, L2, 3, 4: No copper, SR: –

Prepreg Construction

  • GH-100 (Type D) (: 1078, R.C.: 63%)×4ply
  • GEA-700G (: 1078, R.C.: 66%)×4ply
  • GEA-705G (: 1078, R.C.: 65%)×4ply
Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS100

Transmission Loss

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS100

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperture and Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50Ω
  • Proofreading method: TRL(Thru-Reflect-Line)
Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material - MCL-HS100
  • Trace width(w): 0.12–0.14mm
  • Dielectric thickness(b): 0.25mm
  • Trace thickness(t): 18 µm

Thin Laminate

(t0.2mm, t0.4mm)

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS100 MCL-HS100 (Type D)
Tg TMA method A ℃ 240–260 2.4.24
DMA method A 240–260 ‐
CTE *1 X (30–120℃) A ppm/℃ 6–8 ‐
Y (30–120℃) A 6–8
Z (＜Tg) A 20–30 2.2.24
(＞Tg) 130–180
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T-260 (Without copper) A min. ＞60 2.4.24.1
T-288 (Without copper) A ＞60
Decomposition Temperature (TGA method 5% weight loss) A ℃ 430–450 2.3.40
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.2.8
18 µm A 0.8–1.0
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 23–28 2.4.4
Dielectric Constant 10GHz *2 A ‐ 4.2–4.4 3.5–3.7 IEC-62810
Dissipation Factor 10GHz *2 A ‐ 0.0050–0.0060 0.0025–0.0035
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1013–1×1015 ‐

*1) Heating Rate: 10℃/min., *2) Measured by Cavity Resonator., *3) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS100 ‐ 3 µm
12 µm
(LP, HVLP)		 U0.04 0.04mm
3 µm
12 µm
18 µm
35 µm
(LP, RT, HVLP)		 M0.06 0.06mm
0.1 0.10mm
0.2 0.20mm
0.41 0.40mm
(D) 3 µm
12 µm
(LP, HVLP)		 U0.04 0.04mm
3 µm
12 µm
18 µm
35 µm
(LP, RT, HVLP)		 M0.06 0.06mm
0.1 0.10mm
0.2 0.20mm
0.41 0.40mm

Note 1) LP: Low profile copper foil, PF: Profile free copper foil.
Note 2) LP: 3 µm, 12 µm; RT: 18 µm, 35 µm; HVLP: 12 µm, 18 µm, 35 µm.
Note 3) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GH-100 (DF) 0.025 (See [GH-200 (Type DF)]page for ultra thin, flat prepregs)
‐ 0.03 (1027N71) 1027 71±2 0.042
0.05 (1037N71) 1037 71±2 0.050
0.06 (1078N61) 1078 61±2 0.071
0.1 (2116N55) 2116 55±2 0.130
(D) 0.03 (D1027N73) 1027 73±2 0.042
0.05 (D1037N74) 1037 74±2 0.051
0.06 (D1078N63) 1078 63±2 0.072
0.1 (D2116N57) 2116 57±2 0.130
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.