Base Materials for PWBs
Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material – MCL-E-700G (Type R)
Product Information and Application
Product form
- CCL: MCL-E-700G (Type R)
- Prepreg: GEA-700G
Applications
- Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
- HDI, PWB
- Thinner Module PWB.
Features
- Has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
- Well-suited for build-up construction.
- Good drill processability: lower process cost.
Characteristics
Elastic Modulus
Amount of deflection by hole area
Warpage of FC-BGA
TEG Chip
- Chip size: 20mm×20mm
- Chip thickness: 0.725mm
- Bump diameter: 80 µm
- Bump pitch: 200 µm
TEG Substrate
- Sub size: 35mm×35mm
- Core thickness: 0.7mm
- Build up thickness: 30 µm×2 stack
- SR thickness: 20 µm
Thin Laminate
(t0.4mm)
| Item | Condition *3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-E- 700G (Type R) |
||||||
| Tg | TMA method | A | ℃ | 250–270 | 2.4.24 | |
| DMA method | A | 295–305 | ‐ | |||
| CTE *1 | X (30–120℃) | A | ppm/℃ | 8–10 | ‐ | |
| Y (30–120℃) | 8–10 | |||||
| Z *4 | (＜Tg) | A | 15–25 | 2.4.24 | ||
| (＞Tg) | A | 90–120 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | ‐ | ||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | ||
| T-288 (Without Copper) | ＞60 | |||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 430–450 | 2.3.40 | ||
| Heat Resistance for HDI Process (Semi-Additive) | 260℃ Reflow | cycle | ＞20 | ‐ | ||
| Copper Peel Strength | 12 µm | A | kN/m | 0.9–1.1 | 2.4.8 | |
| 18 µm | 1.0–1.2 | |||||
| Surface Roughness (Ra) | A | µm | 2–3 | 2.2.17 | ||
| Flexural Modulus (Lengthwise) *4 | A | GPa | 32–34 | ‐ | ||
| Dielectric Constant | 10GHz *2 | A | － | 4.6–4.8 | ‐ | |
| Dissipation Factor | 10GHz *2 | A | － | 0.008–0.010 | ‐ | |
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | Ω | 1×1013–1×1015 | ||||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | ‐ | ||
| D-2/100 | 1×1012–1×1014 | ‐ | ||||
1) Heating Rate: 10℃/min., *2) Measured by SPDR., *3) Refer to “Condition Note“ *4)t0.8mm
*Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate thickness |
|---|---|---|---|---|
| MCL-E-700G | (R) | 2 µm, 3 µm, 12 µm (LP, PF) |
U0.04 | 0.04mm |
| U0.05 | 0.05mm | |||
| T0.06 | 0.06mm | |||
| (R) | 2 µm 3 µm 12 µm 18 µm (STD, LP, PF) |
M0.06 | 0.06mm | |
| 0.1 | 0.11mm | |||
| M0.11 | 0.10mm | |||
| M0.15 | 0.15mm | |||
| M0.22 | 0.21mm | |||
| 2 µm 3 µm 12 µm 18 µm (STD, LP, PF) |
0.2 | 0.20mm | ||
| 0.31 | 0.30mm | |||
| 0.41 | 0.40mm | |||
| 0.51 | 0.50mm | |||
| 0.61 | 0.60mm | |||
| 0.71 | 0.70mm |
Note1) STD: Standard copper foil, LP: Low profile copper foil, PF: Profile-free copper foil.
Note2) STD: 12 µm, 18 µm; LP: 2 µm, 3 µm, 12 µm, 18 µm; PF: 2 µm, 3 µm, 12 µm.
Note3) ”U” for 1-ply, “T” for 2-ply.
Note4) The thickness means that of dielectric layer.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||||
|---|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination *1 (mm) |
|||||
| GEA-700G | (–) | 0.025 | (1017N74) | 1017 | 74±2 | 0.025 | |
| 0.03 | (1027N74) | 1027 | 74±2 | 0.040 | |||
| 0.04 | (1037N74) | 1037 | 74±2 | 0.048 | |||
| 0.06 | (1078N66) | 1078 | 66±2 | 0.072 | |||
| 0.1 | (2116N59) | 2116 | 59±2 | 0.127 | |||
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||||
*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.