Base Materials for PWBs

Halogen Free, High Tg, High Elastic Modulus and Low CTE material (MCL-E-795G)

Product Information and Application

Product Form

CCL: MCL-E-795G
Prepreg: GEA-795G

Applications

Semiconductor packages. (FC-BGA)
Center core for Buildup construction.

Features

MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
MCL-E-795G type LH has low CTE value.
Well-suited for Center Core of Buildup construction.

Characteristics

Warpage Performance [3-2-3 construction]

Halogen Free, High Tg, High Elastic Modulus and Low CTE material MCL-E-795G

TEG Chip

Die size: 20mm×20mm
Die height: 775 µm

TEG Substrate

Package size: 40mm×40mm
Core thickness: 0.4mm / 0.8mm
BU thickness: 20 µm
SR thickness: 19 µm

Thin Laminate

(t0.4mm)

Item			Condition ^*4	Unit	Acturl value				Reference
Item			Condition ^*4	Unit	MCL-E- 795G	MCL-E- 795G (Type X)	MCL-E- 795G (Type L)	MCL-E- 795G (Type LH)	(IPC-TM-650)
Tg	TMA method		A	℃	260–290				2.4.24
Tg	DMA method		A	℃	315–345				‐
CTE ^*1	X (30–120℃)		A	ppm/℃	3.0–5.0	2.0–4.0	1.0–3.5	0.5–3.0	‐
	Y (30–120℃)		A		3.0–5.0	2.0–4.0	1.0–3.5	0.5–3.0	‐
	Z ^*2	(＜Tg)	A		10–15				2.4.24
	Z ^*2	(＞Tg)	A		70–100				2.4.24
Solder Heat Resistance (260℃)			A	sec.	＞300				‐
T-260 (Without Copper)			A	min.	＞60				2.4.24.1
T-288 (Without Copper)			A	min.	＞60				2.4.24.1
Decomposition Temperature (TGA, 5% weight loss)			A	℃	470–490				2.3.40
Copper Peel strength	12 µm		A	kN/m	0.7–0.9				2.4.8
Copper Peel strength	18 µm		A	kN/m	0.8–1.0				2.4.8
Flexural Modulus (X) ^*2			A	GPa	35–37	37–39	39–41	40–42	‐
Dielectric Constant	1GHz ^*3		A	－	4.3–4.5	4.2–4.4	4.1–4.3	4.1–4.3	‐
Dissipation Factor	1GHz ^*3		A	－	0.005–0.007	0.005–0.007	0.005–0.007	0.005–0.007	‐
Volume Resistivity			C-96/40/90	Ω･cm	1×10¹⁴–1×10¹⁶				2.5.17
Surface Resistance			C-96/40/90	Ω	1×10¹³–1×10¹⁵				2.5.17
Insulation Resistance			A	Ω	1×10¹⁴–1×10¹⁶				‐
Insulation Resistance			D-2/100	Ω	1×10¹²–1×10¹⁵				‐

*1) Heating Rate: 10℃/min., *2) For 800um thickness., *3) Measured by SPDR., *4) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number	Type	Copper Foil Thickness	Thickness code	Actual thickness and Tolerance
MCL-E- 795G	－	12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP)	M0.06	0.06mm
			0.1	0.11mm
			0.2	0.21mm
			0.41	0.41mm
			0.61	0.61mm
			0.81	0.82mm
			1.01	1.02mm
			1.21	1.23mm
			1.41	1.43mm
	(X)	12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP)	0.41	0.41mm
			0.61	0.62mm
			0.81	0.82mm
			1.01	1.02mm
			1.21	1.23mm
			1.41	1.43mm
	(L)	12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP)	0.1	0.11mm
			0.2	0.21mm
			0.41	0.41mm
			0.61	0.62mm
			0.81	0.82mm
			1.01	1.03mm
			1.21	1.24mm
			1.41	1.44mm
	(LH)	12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP)	D0.15	0.16mm
			0.2	0.21mm
			0.41	0.43mm
			0.61	0.64mm
			0.81	0.85mm
			1.01	1.07mm
			1.21	1.28mm
			1.41	1.49mm

Note 1) STD: Standard copper foil, LP: Low Profile copper foil.
Note 2) The thickness means that of dielectric layer.

Prepreg

Part Number	Type			Glass Cloth	Properties
Part Number	Type			Style	Resin Content (%)	Dielectric Thickness after Lamination ^*1 (mm)
GEA-795G	‐	0.03	(1027N76)	1027	76±2	0.044
		0.04	(1037N76)	1037	76±2	0.053
		0.06	(1078N66)	1078	66±2	0.072
	(L)	0.03	(1027N76)	1027	76±2	0.044
		0.04	(1037N76)	1037	76±2	0.053
		0.06	(1280N63)	1280	63±2	0.072

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.

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