Die Bonding Paste

for Substrate

EPINAL ™ has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.


  • Superior heat resistance improves wire bondability and reduces chip contamination during wire bonding process due to low outgassing.
  • Low stress paste minimizes the die warp and enhances the reliability of large chips
  • Excellent adhesion to solder resist
  • Less void and bleed