EPINAL ™ has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.

• Superior heat resistance improves wire bondability and reduces chip contamination during wire bonding process due to low outgassing.
• Low stress paste minimizes the die warp and enhances the reliability of large chips
• Excellent adhesion to solder resist
• Less void and bleed