Anisotropic Conductive Film

for Solderless Connective Film

for Solderless Connective Film

MF Series is developed based on ACF technology for non display uses.

Features

  • Suitable for thin package devices
  • Fine pitch interconnection
  • Reducing processing cost

Principle of Connection

Applications

for Solderless Connective Film

Others Electronic paper, Touch panel, Printer, Hard disk, Sensor