Functional Film Product

Functional for Semiconductor Related Product

HAE Series

Dicing film is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.

RM Series

Release sheet reduces the flash burr in molding of QFN packages etc.

Features

Various choice of adhesive strength. We are ready to serve a lot of kinds of film and the adhesion strength for various purposes.
Good at expanding.
Adhesion type and no UV treatment required.
Little contamination to a wafer.

Application

Holding the tips of wafer from dicing process to the pick up process.

Standard Specification

HAE-1500 Series

Item		Unit	HAE-1525	HAE-1503L	HAE-1503	HAE-1503H	HAE-1504	HAE-1505	HAE-1506
Standard adhesion		gf/25mn	35	40	50	58	80	130	250
Dimension	Thickness	μm	80
	Width	mm	150
	Length	m	100
Hue of film		–
Material of film		–	PVC
Material of separator		–	PAPER
Properties of machine	Tensile strength	kgf/cm2	260
	Elongation	%	260
	Elastic modulus	kgf/mm2	5.4
	50% modulus	kgf/cm	0.7
Size of chips		–	large<>small

Note : Standard adhesion means an adhesion to the adherent for which SUS430-BA plate used, and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

HAE-1600 Series

Item		Unit	HAE-1625	HAE-1603L	HAE-1603	HAE-1603H	HAE-1604	HAE-1605	HAE-1606
Standard adhesion		gf/25mn	35	40	50	58	80	130	250
Dimension	Thickness	μm	80
	Width	mm	150
	Length	m	100
Hue of film		–
Material of film		–	PVC
Material of separator		–	OPP film
Properties of machine	Tensile strength	kgf/cm2	260
	Elongation	%	260
	Elastic modulus	kgf/mm2	5.4
	50% modulus	kgf/cm	0.7
Size of chips		–	large<>small

Note : Standard adhesion means an adhesion to the adherent for which SUS430-BA plate used and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

Release Sheet RM-4100

Features

RM-4100 is suitable for the general sheet type molding machine.
Flat and fine surface is produced by using RM-4100 because the shape of sheets is very stable in the molding process. RM-4100 is tough to wrinkle and the change of the shape by clamping pressure is also small.
The particular release layer holds lead frames and terminals tightly to prevent the invasion of epoxy molding compound, and the incidence of the flash burr is dramatically decreased.

Characteristics

Item	Unit	RM-4100
Structure	–	Release layer Base Film
Thickness	mm	0.04
Tensile strength	PMa	40
Tensile elongation	%	50
Width	mm	50~300
Length	m	100
Product	–	Roll (Diameter: Approx. 12cm)

Loading RM-4100 and lead frame with chips on mold machine.

Transferring mold resin into cavities after closing and clamping the molds tightly.

Opening the molds and removing the molded lead frame.

The above datasheet is a sample observation value under certain testing conditions, not guaranteed performance.

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