Epoxy Molding Compounds
for Lead Frame
Showa Denko Materials has a top-level market share in epoxy molding compounds. Our products meet the customers’ demands and the changes of package trends.
Features
Applications
- Excellent moisture resistance and heat shock resistance.
- Excellent reflow crack resistance.
DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.
Characteristics
| Item | Unit | CEL-1620 HF16 | CEL-1620 HF17 | CEL-9200 HF10 | CEL-9240 HF10 | CEL-9200 HF9 |
|
|---|---|---|---|---|---|---|---|
| Applications | — | DIP | DIP | QFP, SOP | QFN, PLCC | QFN | |
| Flame retardant type | — | Metal hydroxide | Metal hydroxide | No flame retardant | No flame retardant | Organic phosphorous | |
| Spiral flow | cm | 120 | 80 | 100 | 100 | 110 | |
| Tg | °C | 155 | 150 | 125 | 110 | 110 | |
| CTE | a1 | ppm/°C | 19 | 19 | 8 | 7 | 8 |
| a2 | ppm/°C | 64 | 64 | 33 | 28 | 32 | |
| Flexural modulus | GPa | 16 | 14 | 27 | 33 | 27 | |
| Mold shrinkage | % | 0.45 | 0.55 | 0.17 | 0.16 | 0.22 | |
Process
