Showa Denko Materials develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, Flip Chip BGA, wafer level CSP and so on.
- Excellent moisture resistance & electrical properties.
- Excellent adhesion to the various types of substrates.
- Low ionic impurities.
- Minimum warpage by low CTE.
Features and Characteristics (Typical Values)
|It shows excellent film
formability and voltage
|It is a non-filler type material, excellent impregnation and migration resistance||120°C/15min+
|It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp.||165°C/2h|
|It enables to reduce wafer warpage due to low CTE.||130°C/1h+