News Archive - Resonac America

Americas

News ArchiveKei Tozawa2023-03-01T22:21:42+00:00

News Archive

Resonac Develops Low Thermal Expansion Copper-Clad Laminates for Next-Generation Semiconductor Packages through Simulation
Release Date:02/12/2025
Resonac Transfers Exhaust Gas Abatement Equipment Business in Japan and Taiwan
Release Date:02/05/2025
3M Joins the US-JOINT Consortium for Next-Generation Semiconductor Packaging
Release Date:02/04/2025
Resonac Transfers Shares in Its Subsidiary Handling Secondary Battery Packaging Materials and Food Packaging Materials
Release Date:02/03/2025
Resonac’s Technology for Directly Recycling Mixed Plastic Wastes into Basic Chemicals Selected for NEDO’s Green Innovation Fund
Release Date:01/27/2025
Resonac Launches the Circular Business Model “CirculaC” for Used Plastics and Textiles
Release Date:01/20/2025

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