News Archive - Resonac America

Americas

News ArchiveKei Tozawa2023-03-01T22:21:42+00:00

News Archive

Notice Regarding Partial Amendments to the Articles of Incorporation
Release Date:02/13/2025
Resonac to Revise Amount of Board Director Compensation (in Money) Following Revision of Director Compensation Scheme and to Partially Revise Stock Compensation Scheme
Release Date:02/13/2025
Resonac Develops Low Thermal Expansion Copper-Clad Laminates for Next-Generation Semiconductor Packages through Simulation
Release Date:02/12/2025
Resonac Transfers Exhaust Gas Abatement Equipment Business in Japan and Taiwan
Release Date:02/05/2025
3M Joins the US-JOINT Consortium for Next-Generation Semiconductor Packaging
Release Date:02/04/2025
Resonac Transfers Shares in Its Subsidiary Handling Secondary Battery Packaging Materials and Food Packaging Materials
Release Date:02/03/2025

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