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Kei Tozawa
2023-03-01T22:21:42+00:00
News Archive
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Resonac Corporation Signs Contract to Transfer Shares of Diagnostic Reagent Subsidiaries in Japan, China and the United States
Release Date:03/31/2023
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
Release Date:03/23/2023
Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
Release Date:03/13/2023
RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
Release Date:03/09/2023
Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
Release Date:03/01/2023
Resonac Announces Difference between Performance Forecast and Results
Release Date:02/14/2023
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