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Kei Tozawa
2023-03-01T22:21:42+00:00
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Resonac Group to Integrate and Relocate Head Offices
Release Date:04/04/2023
Be Co-creative, and Let’s Achieve Reform Together — President Takahashi sends message at the first company entrance ceremony of Resonac —
Release Date:04/03/2023
DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter — The new inverter will be installed in Toyota’s new BEV “LEXUS RZ” —
Release Date:03/31/2023
Mr. Tsuneishi Takes Office as Outside Director of Resonac Holdings — Former Chairman of a semiconductor production equipment company will help Resonac to strengthen management power to compete in the semiconductor materials market —
Release Date:03/31/2023
Resonac Corporation Signs Contract to Transfer Shares of Diagnostic Reagent Subsidiaries in Japan, China and the United States
Release Date:03/31/2023
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
Release Date:03/23/2023
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