Anisotropic Conductive Film
for COG
This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.
Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Principle of Connection
Applications
Interconnection between LCD and driver IC
Characteristics (Typical Values)
| Item | Unit | AC-8000 series | |
|---|---|---|---|
| Application | – | for COG | |
| Fine pitch capability | Min. contact area | μm 2 | 1000 |
| Min. space | μm | 10 | |
| Bonding condition | Temp. | °C | 170~ |
| Time | sec | 5~ | |
| Pressure | PMa | 50~150* | |