Liquid Encapsulants
CEL-C Series
Showa Denko Materials develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, Flip Chip BGA, wafer level CSP and so on.
Features
- Excellent moisture resistance & electrical properties.
- Excellent adhesion to the various types of substrates.
- Low ionic impurities.
- Minimum warpage by low CTE.
Features and Characteristics (Typical Values)
| Applications | Products | Featuers | Curing Conditions (°C/h) |
|
|---|---|---|---|---|
| TCP |  |
CEL-C- 5020 |
It shows excellent film formability and voltage resistance. |
120°C/20min+ 150°C/2h |
| COF (Underfill) |
 |
CEL-C- 3900 |
It is a non-filler type material, excellent impregnation and migration resistance | 120°C/15min+ 150°C/1h |
| FC-BGA (Underfill) |
 |
CEL-C- 3720 |
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. | 165°C/2h |
| WL-CSP |  |
CEL-C- 7700 |
It enables to reduce wafer warpage due to low CTE. | 130°C/1h+ 180°C/3h |