Base Materials for PWBs

Thin Prepreg with Superior Surface Smoothness – GH-100 (Type DF), GH-200 (Type DF)

Product Information and Application

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Features

  • GH-100 (Type DF) and GH-200 (Type DF) have hybrid properties of package and high speed materials.
  • Good for impedance control as thickness variation is small after press.
  • Halogen free material with low CTE values in X, Y directions (α1, α2).
  • Good dielectric properties by applying low dielectric glass cloths.

Characteristics

Surface Smoothness of Prepreg (Microscope)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

Conventional

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

Conventional

Prepreg thickness after Press

Laminate Condition

  • GEA-705G1010F78
  • Copper foil: 3 µm
  • Laminate condition
  • Temp.: 230℃100min
  • Heating rate: 3.0℃/min
  • Pressure: 3MPa

Measurement method

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)
Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

Undulation of prepreg after press (GEA-705G1010F78)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GH-100 (Type DF), GH-200 (Type DF)

Conventional

Prepreg

Item Condition *3 Unit Actual Value Test Method
GH-100
(Type DF)		 GH-200
(Type DF)		 (IPC-TM-650)
Tg TMA method A ℃ 240–260 220–240 2.4.24.5
DMA method A 240–260 250–270 –
CTE *1 (Pull) X (30–120℃) A ppm/℃ 6–8 8–10 2.4.24.5
Y (30–120℃) 6–8 8–10
T260 (Without Copper) A min. >60 >60 2.4.24.1
T288 (Without Copper) >60 >60
Dielectric Constant *2 10GHz A – 3.5–3.7 3.2–3.4 IEC-62610
Dissipation Factor *2 10GHz A – 0.0025–0.0035 0.0020–0.0030

*1) Heating Rate: 10℃/min., *2) Measured by cavity resonator method., *3) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GH-100 (DF) 0.025 1017F71K 1017 71±2 0.027
1017F73K 73±2 0.029
1017F75K 75±2 0.031
1017F77K 77±2 0.034
1017F79K 79±2 0.038
GH-200 (DF) 0.025 1017F68K 1017 68±2 0.020
1017F70K 70±2 0.022
1017F72K 72±2 0.024
1017F74K 74±2 0.026
1017F76K 76±2 0.028
1017F78K 78±2 0.031
1017F80K 80±2 0.034
1017F82K 82±2 0.038
1017F84K 84±2 0.043
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.