Base Materials for PWBs

Thin Prepreg with Superior Surface Smoothness – GEA-705G (Type F), GEA-770G (Type F)

Product Information and Application

Product form

  • Prepreg: GEA-705G (Type F), GEA-770G (Type F)

Applications

  • Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
  • HDI, PWB
  • Thinner module, PWB

Features

  • Superior in impedance control as prepreg thickness variation is small after press.
  • Suitable for fine line formation with its smooth surface.
  • Can achieve insulation layer thickness 16 µm.
  • Suitable for coreless structure by superior variation of dimensional change.
  • Undulation of (Type F) prepreg is small after press and warpage can be reduced at assembly.

Characteristics

Surface Smoothness of Prepreg (Microscope)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

Conventional

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

Conventional

Laminate condition (Sample)

  • GEA-705G 1010F78
  • Copper foil: 3 µm
  • Temp.: 230℃100min
  • Heating rate: 3.0℃/min
  • Pressure: 3MPa

Measurement method

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)
Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

Undulation of prepreg after press (GEA-705G1010F78)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

(Type F)

Thin Prepreg with Superior Surface Smoothness - GEA-705G (Type F), GEA-770G (Type F)

Conventional

Prepreg

Item Condition *2 Unit Actual Value Test Method
GEA-705G (Type F) GEA-770G (Type F) (IPC-TM-650)
Tg TMA method A ℃ 250–270 260–280 2.4.24.5
DMA method A 295–305 300–330 –
CTE *1 (Pull) X (30–120℃) A ppm/℃ 8–10 6–7 2.4.24.5
Y (30–120℃) 2–5 2–4
T260 (Without Copper) A min. >60 >60 2.4.24.1
T288 (Without Copper) >60 >60
Undulation (After Press) A mm 0.0–0.3 0.0–0.3 –

*1) Heating Rate: 10℃/min., *2) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GEA-705G (F) 0.020 1010F74 1010 74±2 0.021
1010F76 76±2 0.023
1010F78 78±2 0.025
1010F80 80±2 0.027
1010F84 84±2 0.035
0.025 1017F73 1017 73±2 0.025
1017F78 78±2 0.031
1017F83 83±2 0.040
GEA-770G (F) 0.020 1010F67 1010 67±2 0.016
1010F69 69±2 0.018
1010F71 71±2 0.019
1010F73 73±2 0.021
1010F78 78±2 0.026
1010F82 82±2 0.032
0.025 1017F73 1017 73±2 0.026
1017F78 78±2 0.033
1017F83 83±2 0.043
0.030 1027F73 1027 73±2 0.042
1027F78 78±2 0.052
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.