Base Materials for PWBs

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material – MCL-E-679FG

Product Information and Application

Product form

  • CCL: MCL-E-679FG, MCL-E-679FGB 〈Black Type〉
  • Prepreg: GEA-679FG

Applications

  • Semiconductor packages. (FC-BGA, BGA, CSP)
  • Build up PWB.
  • Personal computer, high density electronic equipment.

Features

  • Halogen free material for environmental concerns.
  • CTE (Z-direction) is 50% lower than that of our standard FR-4.
  • Elastic modulus is 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
  • Superior heat resistance for soldering (suitable for lead free process).
  • Suitable for fine patterning with 1/4 surface roughness of our standard FR-4 pattern possible.

Characteristics

Through-hole reliability

Test condition: －55℃, 30min. ⇔150℃, 30min.
Pattern: Wall to wall distance 0.3mm, Laminate thickness: t0.8mm
Pre-condition: 260℃ reflow × 2times⇒Solder dipping (260℃ 10sec.)

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material MCL-E-679FG

Stiffness Properties

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material MCL-E-679FG

Prepreg thickness after pattern filling (Inner layer copper 15 µm)

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material MCL-E-679FG

Thin Laminate

Item Condition *3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
679FGB
(Type R)		 MCL-E-
679FG
(Type R)		 MCL-E-
679FGB
(Type S)		 MCL-E-
679FG
(Type S)
Tg TMA method A ℃ 165–175 175–185 2.4.24
DMA method A 200–220 210–230 ‐
CTE *1 X (30–120℃) A ppm/℃ 13–15 12–14 ‐
Y (30–120℃) A 13–15 12–14
Z (＜Tg) A 23–33 20–30 2.4.24
(＞Tg) 140–170 130–160
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T-260 (Without Copper) A min. ＞60 2.4.24.1
T-288 (Without Copper) A ＞60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 340–360 2.3.40
Heat Resistance for HDI Process 260℃ Reflow cycles ＞10 ‐
Copper Peel Strength 18 µm A kN/m 0.9–1.1 1.1–1.2 2.4.8
35 µm A 1.1–1.2 1.2–1.3
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 23–28 24–29 ‐
Dielectric Constant 1GHz *2 A ‐ 4.9–5.1 ‐
10GHz *2 4.8–5.0 ‐
Dissipation Factor 1GHz *2 A ‐ 0.013–0.015 ‐
10GHz *2 0.014–0.016 ‐
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐

*1) Heating Rate: 10℃/min., *2) Measured by SPDR method., *3) Refer to “Condition Note”
*Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-E-679FG
MCL-E-679FGB		 (S) 3 µm U0.03 0.030mm
U0.04 0.040mm
U0.05 0.050mm
T0.04 0.040mm
T0.06 0.060mm
3, 12, 18 µm
(STD, LP)		 T0.07 0.070mm
M0.06 0.07mm
(R)
(S)		 3 µm
12 µm
18 µm, 35 µm
(STD, LP)		 0.1 0.11mm
0.2 0.20mm
0.41 0.40mm
0.81 0.80mm

Note1) STD: Standard copper foil, LP: Low profile copper foil,
Note2) STD: 12 µm, 18 µm, 35 µm; LP: 3 µm, 12 µm, 18 µm.
Note3) “U” for 1-ply“; T” for 2-ply.
Note4) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination *1 (mm)
GEA-679FG *2 (R) 0.03 (GBPE) 1027 73±2 0.040
0.04 (GRZPE) 1037 73±2 0.048
0.06 (GRROE) 1078 68±2 0.079
0.1 (GRSKE) 2116 58±2 0.127
(S) 0.03 (GSBPE) 1027 73±2 0.040
0.03 (GSBSE) 1027 78±2 0.050
0.04 (GSZPE) 1037 73±2 0.048
0.06 (GSROE) 1078 68±2 0.079
0.1 (GSSKE) 2116 58±2 0.127
Reference (IPC-TM-650) 2.3.16 ‐

*1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
This value changes depending on the press condition or inner layer pattern.
*2) Black type is not available for prepreg.