Die Bonding Film
Dicing Die Bonding Film
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it has achieved easy handling of thinner wafer.
FH series is a co-developed product with The Furukawa Electric Co., Ltd.
Features
- Excellent dicing and pick-up performance.
- Low lamination temperature to a wafer.
- Excellent wire bondability without film curling.
- Excellent reflow crack resistance.
Characteristics (Typical Values)
| Item | Unit | FH-800 | FH-900 | FH-9011 | Test method | ||
|---|---|---|---|---|---|---|---|
| Adhesive thickness | μm | 10, 20 | 10, 20, 25, 40 | 10, 20, 25, 40 | — | ||
| DC tape properties | Exposure doze | mJ/cm2 | 150~400 | 150~400 | 150~400 | — | |
| Adhesive strength between DCT and DBF | Before UV | N/25mm | 1.4 | 1.4 | 1.4 | — | |
| After UV | N/25mm | <0.1 | <0.1 | <0.1 | — | ||
| Wafer laminating temp. | °C | 60~90 | 60~90 | 60~80 | — | ||
| Die bonding condition | Temp. | °C | 100~160 | 100~160 | 100~160 | — | |
| Load | MPa | 0.05~2.0 | 0.05~2.0 | 0.05~2.0 | — | ||
| Elastic modulus (35c) | MPa | 280 | 200 | 200 | DMA | ||
| Tg | °C | 165 | 180 | 180 | TMA | ||
| Die shear strength (260C) | N/chip | >100 | >100 | >100 | 5x5mm chip | ||
Process
